Introducing the 'Paddle' Our proprietary Wafer Handling Tool, pattent pending, uses vacuum technology to hold the wafer, round or psuedo square, on the non-device side. Covered with industry proven Ultem (tm) plastic it leaves no residual evidence on the mating surface. The Paddle has an approximate thickness of .024" (610 microns) that easily interweaves with the wafer in the standard carrier pitch of 3/16" and half pitch of 3/32". The Wafer Handling Tool can be built in standard assemblies of 13, 25, 50 and 100 wafer bulk transfering. Options such as wafer detection, sorting and carrier interweaving can be accomplished in most tool configurations. Contact our sales department with your requirements.