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Hi-tech Cv
Ultra-thin Wafer Head
Wafer Handlers
Global Mektronics Inc
+01 602-464-3487
Arizona, USA
All Rights Reserved
Copyright 2010 by Global Mektronics Inc
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Ultra-thin PV Wafer Head
All Rights Reserved
Copyright 2010 by Global Mektronics Inc
Head Description:
* 25 wafer bulk transfering
* Bulk 'Vacuum Made' before transfer motion
* CDA or Nitrogen pressure
* Designed for clean room
* Bulk 'Vacuum Made' before transfer motion
* CDA or Nitrogen pressure
* Designed for clean room
Standard Features:
* 50 wafer bulk transfering
* Individual wafer selectable via UI
* Individual wafer verification via LED
* Individual wafer selectable via UI
* Individual wafer verification via LED
Optional Features:
Ultra-thin Wafer Head
Shown - 50 Wafers
All Options
The Ultra-thin Wafer Head and 'Paddle' design overcomes the edge stress riser contact that are inherent with the traditional 'V-Slot' design. Bernoulli effect heads claim no touch but still require contact with wafer edge to hold the wafer for pickup and transfer. Our tool does NOT make contact with the high stress area of the wafer edges. Our tool holds the wafer with vacuum on the back side with NO ill effects. Bernoulli tools require continuous high pressure air flow to maintain the effect. Our tool only requires nominal air flow during interweaving and either in machine or house vacuum.
Optional Features: